Global IC Substrate market will reach 8810 million US$ by the end of 2025

Publisher: QYResearch
Published Date: 2019/9/17

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Including Rigid Substrate, Flexible Substrate, Ceramic Substrates by Materials, and WB (wire bonding), FC (flip chip) IC-Substrate by packaging method. The IC-Substrate is mainly used for PC (Tablet, Laptop), Smart Phone, Wearable Devices and Other Devices. And PC (Tablet, Laptop) is the largest usage with the share of about 46%, followed by smart phones (33.9%).

In 2018, about 14.0 million square meters of IC-Substrate are produced worldwide, generating the revenue of about $7586 million. The global IC-Substrate will be valued at 8810 million US$ in 2025, with a CAGR of 1.8% between 2019 and 2025.

Japan, Korea and Taiwan are dominating the global IC-Substrate market and have strong voices in high end market. China is also an important producer, but most of the products are low end products. Currently there are four Taiwanese producers have manufacturing bases in China mainland, mainly located in Suzhou, Kunshan and Shanghai; and there also four local producers located in Shenzhen, Chongqin, Zhuhai and Wuxi.

Currently, Ibiden, Shinko, Kyocera, Eastern, TTM Technologies, Unimicron, Kinsus, Nanya, ASE, Semco, LG Innotek, Simmtech, Daeduck, KCC (Korea Circuit Company), Zhen Ding Technology, AT&S, Shennan Circuit, ACCESS and Shenzhen Fastprint Circuit Tech are the well-known players in the global IC-Substrate market, and the top 10 players took up about 80% of the global market in 2018. Ibiden, Shinko, Kyocera are the Japanese well-known producers of IC-Substrate at present.

In future, the demand from high-performance and high-speed semiconductors and servers, wearable Devices and entertainment equipment, will drive the IC-Substrate market to grow further.

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