Global Flip Chip Bonder market will reach 563.57 million US$ by the end of 2025

Publisher: QYResearch

Published Date: 2019/8/27

The smartphone market has grown rapidly for the past few years, and has entered into a mature phase. Meanwhile, the new driving force for the semiconductor market shifts to the IoT market. Over 50 billions of things will be virtually connected on the internet by 2020, and a change can be seen in the demand for semiconductor devices. In the future, it will be essential for big servers and supercomputers to be larger volume and higher speed, and for mobile devices to be energy saving as well as smaller and thinner sized. Due to these changes in the trend of semiconductor packaging, the popularity of wireless processes, such as flip chip and wafer-level packaging, is expected to grow. To respond to the trend, the enterprises have been enhancing the product lineup for the flip-chip bonder market.

Our report researched the whole industry of Flip Chip Bonder including the global market, market status in different area and revenues for different types and applications of the industry, also including the financial status of vendors. Finally, from all these researches and analysis, we made some rational prediction, and the conclusions are as follows:

Flip Chip Bonder industry is relatively concentrated, manufacturers are mostly in the Europe, US and Asia. As for the downstream market, China sales accounted for more than 23.73% of the total sales of global Flip Chip Bonder in 2018. Besi is the world leading manufacturer in global Flip Chip Bonder market with the market share of 33.68%, in terms of revenue.

Compared to 2017, Flip Chip Bonder market increased sales by 5.92 percent to 608 units worldwide in 2018 from 574 units in 2017. It shows that the Flip Chip Bonder market performance is positive, despite the weak economic environment.

The Flip Chip Bonder market has witnessed significant growth in the past few years, and is expected to maintain this trend during the forecast period. The global Flip Chip Bonder market is expected to reach $563.57 million by 2025 from $276.18 million in 2019, growing at a CAGR of 12.62% from 2019 to 2025. And China market is expected to keep being the biggest market with sales market share of 33.55% in 2025.

Click to view the full report: https://www.qyresearch.com/index/detail/960187/global-flip-chip-bonder-growth-potential-2019

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