Global DBC Ceramic Substrate market will reach 340 million US$ by the end of 2025

Publisher: QYResearch

Published Date: 2018/12/5

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic.

The DBC ceramic substrates market developed rapidly in the past several years, and dominated by the players from Japan, Germany, Korea and China, like Rogers/Curamik, Heraeus Electronics and IXYS (Germany Division) from Germany; KCC from Korea, NGK Electronics Devices and Mitsubishi Materials from Japan; Stellar Industries Corp and Remtec from United States, while Tong Hsing (acquired HCS) from Taiwan. China is also an important producer, and there are three companies in China to produce and sell DBC ceramic substrates, they are Ferrotec (Shanghai Shenhe Thermo-Magnetics Electronics), Zibo Linzi Yinhe High-Tech Development and Nanjing Zhongjiang New Material Science & Technology.

In future, the DBC ceramic substrates market will develop rapidly, driven by the demand from IGBT, automobile, CPV, aerospace and communication. The electric vehicles market will drive the DBC ceramic substrates to increase in next ten years.

The global DBC Ceramic Substrate market is valued at 160 million US$ in 2017 and will reach 340 million US$ by the end of 2025, growing at a CAGR of 9.6% during 2018-2025.

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